Item | Production Capacity |
Layer Counts | 1 — 48 layers |
Rigid Flex Boards Layer Counts | 2 — 20 layers |
Board Thickness | 0.20mm — 9.0mm |
Minimum Line | 0.064mm |
Minimum Space | 0.064mm |
Out Layer Copper Thickness | 1.0 OZ — 11.0 OZ |
Inner Layer Copper Thickness | 1.0 OZ — 11.0 OZ |
Min Mechanical Drilling size | 0.15mm |
Laser Drill size | 0.10-0.20mm |
HDI capability | 3+N+3 |
Diameter Tolerance | ±0.080mm |
Registration | 0.050mm |
Aspect Ratio | 12:1 |
Solder Mask Type | LPI Green, Black, Yellow, White, Red, Blue |
Mini. Solder Mask Clearance | 0.050mm |
Legend Type | White, Yellow, Black, Red |
Impedance Control Tolerance | ±10% |
Maximum Size | 1143X610mm |
Board Outline Tolerance | ±0.15mm |
Material Type | FR4, High Tg FR4, Rogers, Nelco, Arlon, Taconic, AL base, PI, etc. |
Surface Finish | Tin/Lead HASL, Lead Free HASL, OSP, ENIG, Gold Plating, Immersion Tin/Silver |