| Item | Production Capacity |
| Layer Counts | 1 — 48 layers |
| Rigid Flex Boards Layer Counts | 2 — 20 layers |
| Board Thickness | 0.20mm — 9.0mm |
| Minimum Line | 0.064mm |
| Minimum Space | 0.064mm |
| Out Layer Copper Thickness | 1.0 OZ — 11.0 OZ |
| Inner Layer Copper Thickness | 1.0 OZ — 11.0 OZ |
| Min Mechanical Drilling size | 0.15mm |
| Laser Drill size | 0.10-0.20mm |
| HDI capability | 3+N+3 |
| Diameter Tolerance | ±0.080mm |
| Registration | 0.050mm |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI Green, Black, Yellow, White, Red, Blue |
| Mini. Solder Mask Clearance | 0.050mm |
| Legend Type | White, Yellow, Black, Red |
| Impedance Control Tolerance | ±10% |
| Maximum Size | 1143X610mm |
| Board Outline Tolerance | ±0.15mm |
| Material Type | FR4, High Tg FR4, Rogers, Nelco, Arlon, Taconic, AL base, PI, etc. |
| Surface Finish | Tin/Lead HASL, Lead Free HASL, OSP, ENIG, Gold Plating, Immersion Tin/Silver |
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